PETG-Tough Filament
QIDI TECH
PETG-Tough 3D Printer Filament
QIDI TECH PETG-Tough Filament with Modified Toughness
The improved QIDI TECH PETG-Tough 3D printing filament is a rigid,tough,high-performance material with odorless,high impact resistance and high heat resistance.
Suitable For Hyper Speed Printing
Under the same printing conditions, PETG-Tough requires lower extrusion pressure, making it more suitable for hyper speed printing.
Vacuum Aluminum Foil Packaging
According to the test, the water vapor transmission rate of ordinary sealed packaging is 4.76%, while the water vapor transmission rate of vacuum aluminum foil packaging we use is only 0.014%. It can be seen that vacuum aluminum foil packaging is more water-resistant.
Compatible With Most of FDM 3D Printers
We highly recommend to use QIDI TECH PETG-Tough filaments with QIDI TECH X-MAX3 3D printer and QIDI TECH Filament Dryer Box.
Product Size
QIDI TECH PETG-Tough filament 1.75mmWorks perfectly with most FDM 3Dprinters on the market.
Original: $25.99
-65%$25.99
$9.10
Description
QIDI TECH
PETG-Tough 3D Printer Filament
QIDI TECH PETG-Tough Filament with Modified Toughness
The improved QIDI TECH PETG-Tough 3D printing filament is a rigid,tough,high-performance material with odorless,high impact resistance and high heat resistance.
Suitable For Hyper Speed Printing
Under the same printing conditions, PETG-Tough requires lower extrusion pressure, making it more suitable for hyper speed printing.
Vacuum Aluminum Foil Packaging
According to the test, the water vapor transmission rate of ordinary sealed packaging is 4.76%, while the water vapor transmission rate of vacuum aluminum foil packaging we use is only 0.014%. It can be seen that vacuum aluminum foil packaging is more water-resistant.
Compatible With Most of FDM 3D Printers
We highly recommend to use QIDI TECH PETG-Tough filaments with QIDI TECH X-MAX3 3D printer and QIDI TECH Filament Dryer Box.
Product Size
QIDI TECH PETG-Tough filament 1.75mmWorks perfectly with most FDM 3Dprinters on the market.
